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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/irps/JeongKKKLCBKJSP18>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ayoung_Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Byungwook_Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hanbyul_Kang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/In_Hak_Baick>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jaewon_Chang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jinseok_Kim_0005>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Moonsoo_Lee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sangchul_Shin>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sangwoo_Pae>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Seongwon_Jeong>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Younggeun_Ji>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FIRPS.2018.8353653>
foaf:homepage <https://doi.org/10.1109/IRPS.2018.8353653>
dc:identifier DBLP conf/irps/JeongKKKLCBKJSP18 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FIRPS.2018.8353653 (xsd:string)
dcterms:issued 2018 (xsd:gYear)
rdfs:label Optimal design of dummy ball array in wafer level package to improve board level thermal cycle reliability (BLR). (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ayoung_Kim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Byungwook_Kim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hanbyul_Kang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/In_Hak_Baick>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jaewon_Chang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jinseok_Kim_0005>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Moonsoo_Lee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sangchul_Shin>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sangwoo_Pae>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Seongwon_Jeong>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Younggeun_Ji>
swrc:pages 3 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/irps/2018>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/irps/JeongKKKLCBKJSP18/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/irps/JeongKKKLCBKJSP18>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/irps/irps2018.html#JeongKKKLCBKJSP18>
rdfs:seeAlso <https://doi.org/10.1109/IRPS.2018.8353653>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/irps>
dc:title Optimal design of dummy ball array in wafer level package to improve board level thermal cycle reliability (BLR). (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document