Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/irps/KimOMKTC20
Home
|
Example Publications
Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/conf/irps/KimOMKTC20
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Allison_T._Osmanson
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Choong-Un_Kim
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Hossein_Madanipour
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Patrick_F._Thompson
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Qiao_Chen
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Yi_Ram_Kim
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FIRPS45951.2020.9129337
>
foaf:
homepage
<
https://doi.org/10.1109/IRPS45951.2020.9129337
>
dc:
identifier
DBLP conf/irps/KimOMKTC20
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FIRPS45951.2020.9129337
(xsd:string)
dcterms:
issued
2020
(xsd:gYear)
rdfs:
label
Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Allison_T._Osmanson
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Choong-Un_Kim
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Hossein_Madanipour
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Patrick_F._Thompson
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Qiao_Chen
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Yi_Ram_Kim
>
swrc:
pages
1-5
(xsd:string)
dcterms:
partOf
<
https://dblp.l3s.de/d2r/resource/publications/conf/irps/2020
>
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/conf/irps/KimOMKTC20/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/conf/irps/KimOMKTC20
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/conf/irps/irps2020.html#KimOMKTC20
>
rdfs:
seeAlso
<
https://doi.org/10.1109/IRPS45951.2020.9129337
>
swrc:
series
<
https://dblp.l3s.de/d2r/resource/conferences/irps
>
dc:
title
Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:InProceedings
rdf:
type
foaf:Document