Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/irps/LesniewskaRTVVV20
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dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/conf/irps/LesniewskaRTVVV20
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Alicja_Lesniewska
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Christopher_J._Wilson
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Davide_Tierno
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Kris_Croes
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Marleen_H._van_der_Veen
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Nicolas_Jourdan
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Patrick_Verdonck
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Philippe_J._Roussel
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Victor_Vega-Gonzalez
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Zsolt_T%E2%88%9A%E2%88%82kei
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FIRPS45951.2020.9129246
>
foaf:
homepage
<
https://doi.org/10.1109/IRPS45951.2020.9129246
>
dc:
identifier
DBLP conf/irps/LesniewskaRTVVV20
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FIRPS45951.2020.9129246
(xsd:string)
dcterms:
issued
2020
(xsd:gYear)
rdfs:
label
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Alicja_Lesniewska
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Christopher_J._Wilson
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Davide_Tierno
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Kris_Croes
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Marleen_H._van_der_Veen
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Nicolas_Jourdan
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Patrick_Verdonck
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Philippe_J._Roussel
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Victor_Vega-Gonzalez
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Zsolt_T%E2%88%9A%E2%88%82kei
>
swrc:
pages
1-6
(xsd:string)
dcterms:
partOf
<
https://dblp.l3s.de/d2r/resource/publications/conf/irps/2020
>
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/conf/irps/LesniewskaRTVVV20/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/conf/irps/LesniewskaRTVVV20
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/conf/irps/irps2020.html#LesniewskaRTVVV20
>
rdfs:
seeAlso
<
https://doi.org/10.1109/IRPS45951.2020.9129246
>
swrc:
series
<
https://dblp.l3s.de/d2r/resource/conferences/irps
>
dc:
title
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:InProceedings
rdf:
type
foaf:Document