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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/irps/MallampatiBPC19>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Eng_Chye_Chua>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sandeep_Mallampati>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Scott_Pozder>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Zaeem_Baig>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FIRPS.2019.8720597>
foaf:homepage <https://doi.org/10.1109/IRPS.2019.8720597>
dc:identifier DBLP conf/irps/MallampatiBPC19 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FIRPS.2019.8720597 (xsd:string)
dcterms:issued 2019 (xsd:gYear)
rdfs:label A Comparison of Environmental Stressing Data and Simulation at the Corner of a Test Chip in a FC-BGA Package. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Eng_Chye_Chua>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sandeep_Mallampati>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Scott_Pozder>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Zaeem_Baig>
swrc:pages 1-4 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/irps/2019>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/irps/MallampatiBPC19/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/irps/MallampatiBPC19>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/irps/irps2019.html#MallampatiBPC19>
rdfs:seeAlso <https://doi.org/10.1109/IRPS.2019.8720597>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/irps>
dc:title A Comparison of Environmental Stressing Data and Simulation at the Corner of a Test Chip in a FC-BGA Package. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document