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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/irps/WadatsumiKHMNMH22>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hiromu_Hasegawa>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hisashi_Kondo>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kikuo_Muramatsu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kohei_Kawai>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Makoto_Nagata>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rikuu_Hasegawa>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takahito_Fukushima>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takuji_Miki>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takuya_Sawada>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takuya_Wadatsumi>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FIRPS48227.2022.9764457>
foaf:homepage <https://doi.org/10.1109/IRPS48227.2022.9764457>
dc:identifier DBLP conf/irps/WadatsumiKHMNMH22 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FIRPS48227.2022.9764457 (xsd:string)
dcterms:issued 2022 (xsd:gYear)
rdfs:label Voltage Surges by Backside ESD Impacts on IC Chip in Flip Chip Packaging. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hiromu_Hasegawa>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hisashi_Kondo>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kikuo_Muramatsu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kohei_Kawai>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Makoto_Nagata>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rikuu_Hasegawa>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takahito_Fukushima>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takuji_Miki>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takuya_Sawada>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takuya_Wadatsumi>
swrc:pages 14-1 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/irps/2022>
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owl:sameAs <http://dblp.rkbexplorer.com/id/conf/irps/WadatsumiKHMNMH22>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/irps/irps2022.html#WadatsumiKHMNMH22>
rdfs:seeAlso <https://doi.org/10.1109/IRPS48227.2022.9764457>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/irps>
dc:title Voltage Surges by Backside ESD Impacts on IC Chip in Flip Chip Packaging. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document