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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/irps/YangYOYHH23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kang_Yang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kun_Han>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Shengwei_Yang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Suhui_Yang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yan_Ouyang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yi_He>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FIRPS48203.2023.10117817>
foaf:homepage <https://doi.org/10.1109/IRPS48203.2023.10117817>
dc:identifier DBLP conf/irps/YangYOYHH23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FIRPS48203.2023.10117817 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Stress Migration of Aluminum Backside Interconnect in Xtacking¬ģ. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kang_Yang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kun_Han>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Shengwei_Yang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Suhui_Yang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yan_Ouyang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yi_He>
swrc:pages 1-4 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/irps/2023>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/irps/YangYOYHH23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/irps/YangYOYHH23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/irps/irps2023.html#YangYOYHH23>
rdfs:seeAlso <https://doi.org/10.1109/IRPS48203.2023.10117817>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/irps>
dc:title Stress Migration of Aluminum Backside Interconnect in Xtacking¬ģ. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document