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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/iscas/JiaoDY0S18>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bei_Yu_0001>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bing_Li_0005>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Fengxian_Jiao>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sheqin_Dong>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ulf_Schlichtmann>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FISCAS.2018.8351101>
foaf:homepage <https://doi.org/10.1109/ISCAS.2018.8351101>
dc:identifier DBLP conf/iscas/JiaoDY0S18 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FISCAS.2018.8351101 (xsd:string)
dcterms:issued 2018 (xsd:gYear)
rdfs:label Thermal-Aware Placement and Routing for 3D Optical Networks-on-Chips. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bei_Yu_0001>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bing_Li_0005>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Fengxian_Jiao>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sheqin_Dong>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ulf_Schlichtmann>
swrc:pages 1-4 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/iscas/2018>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/iscas/JiaoDY0S18/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/iscas/JiaoDY0S18>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/iscas/iscas2018.html#JiaoDY0S18>
rdfs:seeAlso <https://doi.org/10.1109/ISCAS.2018.8351101>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/iscas>
dc:title Thermal-Aware Placement and Routing for 3D Optical Networks-on-Chips. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document