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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/iscas/YousufHC15>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Abdul_Hamid_Bin_Yousuf>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Masud_H._Chowdhury>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Nahid_M._Hossain>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FISCAS.2015.7169057>
foaf:homepage <https://doi.org/10.1109/ISCAS.2015.7169057>
dc:identifier DBLP conf/iscas/YousufHC15 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FISCAS.2015.7169057 (xsd:string)
dcterms:issued 2015 (xsd:gYear)
rdfs:label Performance analysis of through silicon via (TSV) and through glass via (TGV) for different materials. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Abdul_Hamid_Bin_Yousuf>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Masud_H._Chowdhury>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Nahid_M._Hossain>
swrc:pages 1957-1960 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/iscas/2015>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/iscas/YousufHC15/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/iscas/YousufHC15>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/iscas/iscas2015.html#YousufHC15>
rdfs:seeAlso <https://doi.org/10.1109/ISCAS.2015.7169057>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/iscas>
dc:title Performance analysis of through silicon via (TSV) and through glass via (TGV) for different materials. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document