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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/ised/PasupuletyHT18>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Basavaraj_Talawar>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bheemappa_Halavar>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ujjwal_Pasupulety>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FISED.2018.8704109>
foaf:homepage <https://doi.org/10.1109/ISED.2018.8704109>
dc:identifier DBLP conf/ised/PasupuletyHT18 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FISED.2018.8704109 (xsd:string)
dcterms:issued 2018 (xsd:gYear)
rdfs:label Thermal Aware Design for Through-Silicon Via (TSV) based 3D Network-on-Chip (NoC) Architectures. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Basavaraj_Talawar>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bheemappa_Halavar>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ujjwal_Pasupulety>
swrc:pages 236-240 (xsd:string)
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owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/ised/PasupuletyHT18/dblp>
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rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/ised/ised2018.html#PasupuletyHT18>
rdfs:seeAlso <https://doi.org/10.1109/ISED.2018.8704109>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/ised>
dc:title Thermal Aware Design for Through-Silicon Via (TSV) based 3D Network-on-Chip (NoC) Architectures. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document