Time-borrowing multi-cycle on-chip interconnects for delay variation tolerance.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/islped/BowmanTKGID06
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2006
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Time-borrowing multi-cycle on-chip interconnects for delay variation tolerance.
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interconnect, intra-die variations, multi-cycle interconnect, parameter fluctuations, parameter variations, time borrowing, variation tolerant, within-die variations
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Time-borrowing multi-cycle on-chip interconnects for delay variation tolerance.
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