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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/islped/JainKKK08>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chris_H._Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/John_Keane_0001>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Pulkit_Jain>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tony_Tae-Hyoung_Kim>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1145%2F1393921.1393940>
foaf:homepage <https://doi.org/10.1145/1393921.1393940>
dc:identifier DBLP conf/islped/JainKKK08 (xsd:string)
dc:identifier DOI doi.org%2F10.1145%2F1393921.1393940 (xsd:string)
dcterms:issued 2008 (xsd:gYear)
rdfs:label A multi-story power delivery technique for 3D integrated circuits. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chris_H._Kim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/John_Keane_0001>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Pulkit_Jain>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tony_Tae-Hyoung_Kim>
swrc:pages 57-62 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/islped/2008>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/islped/JainKKK08/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/islped/JainKKK08>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/islped/islped2008.html#JainKKK08>
rdfs:seeAlso <https://doi.org/10.1145/1393921.1393940>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/islped>
dc:title A multi-story power delivery technique for 3D integrated circuits. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document