SOI, interconnect, package, and mainboard thermal characterization. | D2R Server publishing the DBLP Bibliography Database, hosted at L3S Research Center

Property	Value
dcterms:bibliographicCitation	<http://dblp.uni-trier.de/rec/bibtex/conf/islped/Nayfach-BattilanaR09>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Jose_Renau>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Joseph_Nayfach-Battilana>
foaf:homepage	<http://dx.doi.org/doi.org%2F10.1145%2F1594233.1594314>
foaf:homepage	<https://doi.org/10.1145/1594233.1594314>
dc:identifier	DBLP conf/islped/Nayfach-BattilanaR09 (xsd:string)
dc:identifier	DOI doi.org%2F10.1145%2F1594233.1594314 (xsd:string)
dcterms:issued	2009 (xsd:gYear)
rdfs:label	SOI, interconnect, package, and mainboard thermal characterization. (xsd:string)
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Jose_Renau>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Joseph_Nayfach-Battilana>
swrc:pages	327-330 (xsd:string)
dcterms:partOf	<https://dblp.l3s.de/d2r/resource/publications/conf/islped/2009>
owl:sameAs	<http://bibsonomy.org/uri/bibtexkey/conf/islped/Nayfach-BattilanaR09/dblp>
owl:sameAs	<http://dblp.rkbexplorer.com/id/conf/islped/Nayfach-BattilanaR09>
rdfs:seeAlso	<http://dblp.uni-trier.de/db/conf/islped/islped2009.html#Nayfach-BattilanaR09>
rdfs:seeAlso	<https://doi.org/10.1145/1594233.1594314>
swrc:series	<https://dblp.l3s.de/d2r/resource/conferences/islped>
dc:subject	SOI modeling, interconnect modeling, package modeling, thermal modeling (xsd:string)
dc:title	SOI, interconnect, package, and mainboard thermal characterization. (xsd:string)
dc:type	<http://purl.org/dc/dcmitype/Text>
rdf:type	swrc:InProceedings
rdf:type	foaf:Document