Hardware Efficient Built-in Self-test Architecture for Power and Ground TSVs in 3D IC.
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dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/conf/isocc/HanLLK21
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Donghyun_Han
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Sooryeong_Lee
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Sungho_Kang_0001
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Youngkwang_Lee
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FISOCC53507.2021.9613959
>
foaf:
homepage
<
https://doi.org/10.1109/ISOCC53507.2021.9613959
>
dc:
identifier
DBLP conf/isocc/HanLLK21
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FISOCC53507.2021.9613959
(xsd:string)
dcterms:
issued
2021
(xsd:gYear)
rdfs:
label
Hardware Efficient Built-in Self-test Architecture for Power and Ground TSVs in 3D IC.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Donghyun_Han
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Sooryeong_Lee
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Sungho_Kang_0001
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Youngkwang_Lee
>
swrc:
pages
101-102
(xsd:string)
dcterms:
partOf
<
https://dblp.l3s.de/d2r/resource/publications/conf/isocc/2021
>
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/conf/isocc/HanLLK21/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/conf/isocc/HanLLK21
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/conf/isocc/isocc2021.html#HanLLK21
>
rdfs:
seeAlso
<
https://doi.org/10.1109/ISOCC53507.2021.9613959
>
swrc:
series
<
https://dblp.l3s.de/d2r/resource/conferences/isocc
>
dc:
title
Hardware Efficient Built-in Self-test Architecture for Power and Ground TSVs in 3D IC.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:InProceedings
rdf:
type
foaf:Document