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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/isocc/JongKyungSM23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jeong_Min-Seong>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Park_Jong-Kyung>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Park_Sang-Woo>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FISOCC59558.2023.10396380>
foaf:homepage <https://doi.org/10.1109/ISOCC59558.2023.10396380>
dc:identifier DBLP conf/isocc/JongKyungSM23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FISOCC59558.2023.10396380 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Advancements in Metal Passivation Process for Low-Temperature Cu-Cu Direct Bonding. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jeong_Min-Seong>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Park_Jong-Kyung>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Park_Sang-Woo>
swrc:pages 223-224 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/isocc/2023>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/isocc/JongKyungSM23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/isocc/JongKyungSM23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/isocc/isocc2023.html#JongKyungSM23>
rdfs:seeAlso <https://doi.org/10.1109/ISOCC59558.2023.10396380>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/isocc>
dc:title Advancements in Metal Passivation Process for Low-Temperature Cu-Cu Direct Bonding. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document