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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/ispd/ChangCM00>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Keh-Jeng_Chang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Li-Fu_Chang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Robert_Mathews>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1145%2F332357.332386>
foaf:homepage <https://doi.org/10.1145/332357.332386>
dc:identifier DBLP conf/ispd/ChangCM00 (xsd:string)
dc:identifier DOI doi.org%2F10.1145%2F332357.332386 (xsd:string)
dcterms:issued 2000 (xsd:gYear)
rdfs:label Simulating frequency-dependent current distribution for inductance modeling of on-chip copper interconnects. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Keh-Jeng_Chang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Li-Fu_Chang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Robert_Mathews>
swrc:pages 117-120 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/ispd/2000>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/ispd/ChangCM00/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/ispd/ChangCM00>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/ispd/ispd2000.html#ChangCM00>
rdfs:seeAlso <https://doi.org/10.1145/332357.332386>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/ispd>
dc:subject cladding material, copper interconnect, electromagnetic field solvers, skin-effect current distribution (xsd:string)
dc:title Simulating frequency-dependent current distribution for inductance modeling of on-chip copper interconnects. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document