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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/ispd/WangLC03>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Charlie_Chung-Ping_Chen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ting-Yuan_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yu-Min_Lee>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1145%2F640000.640007>
foaf:homepage <https://doi.org/10.1145/640000.640007>
dc:identifier DBLP conf/ispd/WangLC03 (xsd:string)
dc:identifier DOI doi.org%2F10.1145%2F640000.640007 (xsd:string)
dcterms:issued 2003 (xsd:gYear)
rdfs:label 3D thermal-ADI: an efficient chip-level transient thermal simulator. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Charlie_Chung-Ping_Chen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ting-Yuan_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yu-Min_Lee>
swrc:pages 10-17 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/ispd/2003>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/ispd/WangLC03/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/ispd/WangLC03>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/ispd/ispd2003.html#WangLC03>
rdfs:seeAlso <https://doi.org/10.1145/640000.640007>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/ispd>
dc:subject ADI, automation, design, finite difference methods, temperature, thermal simulation (xsd:string)
dc:title 3D thermal-ADI: an efficient chip-level transient thermal simulator. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document