Method for monitoring the icing thickness of ground wire using sag measurement technology (iSPEC 2023).
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/ispec2/LeiQWXJB23
Home
|
Example Publications
Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/conf/ispec2/LeiQWXJB23
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Haitao_Wu
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Hu_Qin
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Jiang_Xingliang
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Jiankang_Bao
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Liu_Jie
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Zhengfei_Lei
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FiSPEC58282.2023.10403032
>
foaf:
homepage
<
https://doi.org/10.1109/iSPEC58282.2023.10403032
>
dc:
identifier
DBLP conf/ispec2/LeiQWXJB23
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FiSPEC58282.2023.10403032
(xsd:string)
dcterms:
issued
2023
(xsd:gYear)
rdfs:
label
Method for monitoring the icing thickness of ground wire using sag measurement technology (iSPEC 2023).
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Haitao_Wu
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Hu_Qin
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Jiang_Xingliang
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Jiankang_Bao
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Liu_Jie
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Zhengfei_Lei
>
swrc:
pages
1-6
(xsd:string)
dcterms:
partOf
<
https://dblp.l3s.de/d2r/resource/publications/conf/ispec2/2023
>
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/conf/ispec2/LeiQWXJB23/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/conf/ispec2/LeiQWXJB23
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/conf/ispec2/ispec2023.html#LeiQWXJB23
>
rdfs:
seeAlso
<
https://doi.org/10.1109/iSPEC58282.2023.10403032
>
swrc:
series
<
https://dblp.l3s.de/d2r/resource/conferences/ispec2
>
dc:
title
Method for monitoring the icing thickness of ground wire using sag measurement technology (iSPEC 2023).
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:InProceedings
rdf:
type
foaf:Document