Electromigration Reliability Comparison of Cu and Al Interconnects.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/isqed/AlamWGTT05
Home
|
Example Publications
Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/conf/isqed/AlamWGTT05
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Carl_V._Thompson
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Chee_Lip_Gan
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Donald_E._Troxel
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Frank_L._Wei
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Syed_M._Alam
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FISQED.2005.51
>
foaf:
homepage
<
https://doi.org/10.1109/ISQED.2005.51
>
dc:
identifier
DBLP conf/isqed/AlamWGTT05
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FISQED.2005.51
(xsd:string)
dcterms:
issued
2005
(xsd:gYear)
rdfs:
label
Electromigration Reliability Comparison of Cu and Al Interconnects.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Carl_V._Thompson
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Chee_Lip_Gan
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Donald_E._Troxel
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Frank_L._Wei
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Syed_M._Alam
>
swrc:
pages
303-308
(xsd:string)
dcterms:
partOf
<
https://dblp.l3s.de/d2r/resource/publications/conf/isqed/2005
>
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/conf/isqed/AlamWGTT05/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/conf/isqed/AlamWGTT05
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/conf/isqed/isqed2005.html#AlamWGTT05
>
rdfs:
seeAlso
<
https://doi.org/10.1109/ISQED.2005.51
>
swrc:
series
<
https://dblp.l3s.de/d2r/resource/conferences/isqed
>
dc:
title
Electromigration Reliability Comparison of Cu and Al Interconnects.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:InProceedings
rdf:
type
foaf:Document