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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/isqed/KhalilIKKD08>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/DiaaEldin_Khalil>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Muhammad_M._Khellah>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tanay_Karnik>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Vivek_De>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yehea_I._Ismail>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FISQED.2008.4479795>
foaf:homepage <https://doi.org/10.1109/ISQED.2008.4479795>
dc:identifier DBLP conf/isqed/KhalilIKKD08 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FISQED.2008.4479795 (xsd:string)
dcterms:issued 2008 (xsd:gYear)
rdfs:label Analytical Model for the Propagation Delay of Through Silicon Vias. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/DiaaEldin_Khalil>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Muhammad_M._Khellah>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tanay_Karnik>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Vivek_De>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yehea_I._Ismail>
swrc:pages 553-556 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/isqed/2008>
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owl:sameAs <http://dblp.rkbexplorer.com/id/conf/isqed/KhalilIKKD08>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/isqed/isqed2008.html#KhalilIKKD08>
rdfs:seeAlso <https://doi.org/10.1109/ISQED.2008.4479795>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/isqed>
dc:subject TSV, 3D integrated circuits, propagation delay model, dimensional analysis (xsd:string)
dc:title Analytical Model for the Propagation Delay of Through Silicon Vias. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document