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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/isqed/KurokawaKIKFKIM05>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Akira_Kasebe>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Atsushi_Kurokawa>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hiroo_Masuda>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tetsuro_Kage>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tetsuya_Ibe>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Toshiki_Kanamoto>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Wei_Fong_Chang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yasuaki_Inoue>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FISQED.2005.47>
foaf:homepage <https://doi.org/10.1109/ISQED.2005.47>
dc:identifier DBLP conf/isqed/KurokawaKIKFKIM05 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FISQED.2005.47 (xsd:string)
dcterms:issued 2005 (xsd:gYear)
rdfs:label Dummy Filling Methods for Reducing Interconnect Capacitance and Number of Fills. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Akira_Kasebe>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Atsushi_Kurokawa>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hiroo_Masuda>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tetsuro_Kage>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tetsuya_Ibe>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Toshiki_Kanamoto>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Wei_Fong_Chang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yasuaki_Inoue>
swrc:pages 586-591 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/isqed/2005>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/isqed/KurokawaKIKFKIM05/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/isqed/KurokawaKIKFKIM05>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/isqed/isqed2005.html#KurokawaKIKFKIM05>
rdfs:seeAlso <https://doi.org/10.1109/ISQED.2005.47>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/isqed>
dc:title Dummy Filling Methods for Reducing Interconnect Capacitance and Number of Fills. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document