Investigation of the capacitance deviation due to metal-fills and the effective interconnect geometry modeling.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/isqed/LeeLPKPK03
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Investigation of the capacitance deviation due to metal-fills and the effective interconnect geometry modeling.
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Investigation of the capacitance deviation due to metal-fills and the effective interconnect geometry modeling.
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