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dc:creator <https://dblp.l3s.de/d2r/resource/authors/Joseph_B._Bernstein>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Michael_Talmor>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/X._Zhang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xiaojun_Li_0001>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Z._Gur>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FISQED.2005.37>
foaf:homepage <https://doi.org/10.1109/ISQED.2005.37>
dc:identifier DBLP conf/isqed/LiHQZTGB05 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FISQED.2005.37 (xsd:string)
dcterms:issued 2005 (xsd:gYear)
rdfs:label Deep Submicron CMOS Integrated Circuit Reliability Simulation with SPICE. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bing_Huang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/J._Qin>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Joseph_B._Bernstein>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Michael_Talmor>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/X._Zhang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xiaojun_Li_0001>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Z._Gur>
swrc:pages 382-389 (xsd:string)
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rdfs:seeAlso <https://doi.org/10.1109/ISQED.2005.37>
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dc:title Deep Submicron CMOS Integrated Circuit Reliability Simulation with SPICE. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document