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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/isqed/SongLKLCKPAKY11>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chang_Liu_0034>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Dae_Hyun_Kim_0004>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jonghyun_Cho>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Joohee_Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Joungho_Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Junso_Pak>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kihyun_Yoon>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Seungyoung_Ahn>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sung_Kyu_Lim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Taigon_Song>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FISQED.2011.5770714>
foaf:homepage <https://doi.org/10.1109/ISQED.2011.5770714>
dc:identifier DBLP conf/isqed/SongLKLCKPAKY11 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FISQED.2011.5770714 (xsd:string)
dcterms:issued 2011 (xsd:gYear)
rdfs:label Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chang_Liu_0034>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Dae_Hyun_Kim_0004>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jonghyun_Cho>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Joohee_Kim>
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foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Junso_Pak>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kihyun_Yoon>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Seungyoung_Ahn>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sung_Kyu_Lim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Taigon_Song>
swrc:pages 122-128 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/isqed/2011>
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rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/isqed/isqed2011.html#SongLKLCKPAKY11>
rdfs:seeAlso <https://doi.org/10.1109/ISQED.2011.5770714>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/isqed>
dc:title Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document