Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/isqed/SongLKLCKPAKY11
Home
|
Example Publications
Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/conf/isqed/SongLKLCKPAKY11
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Chang_Liu_0034
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Dae_Hyun_Kim_0004
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Jonghyun_Cho
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Joohee_Kim
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Joungho_Kim
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Junso_Pak
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Kihyun_Yoon
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Seungyoung_Ahn
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Sung_Kyu_Lim
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Taigon_Song
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FISQED.2011.5770714
>
foaf:
homepage
<
https://doi.org/10.1109/ISQED.2011.5770714
>
dc:
identifier
DBLP conf/isqed/SongLKLCKPAKY11
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FISQED.2011.5770714
(xsd:string)
dcterms:
issued
2011
(xsd:gYear)
rdfs:
label
Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Chang_Liu_0034
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Dae_Hyun_Kim_0004
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Jonghyun_Cho
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Joohee_Kim
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Joungho_Kim
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Junso_Pak
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Kihyun_Yoon
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Seungyoung_Ahn
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Sung_Kyu_Lim
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Taigon_Song
>
swrc:
pages
122-128
(xsd:string)
dcterms:
partOf
<
https://dblp.l3s.de/d2r/resource/publications/conf/isqed/2011
>
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/conf/isqed/SongLKLCKPAKY11/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/conf/isqed/SongLKLCKPAKY11
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/conf/isqed/isqed2011.html#SongLKLCKPAKY11
>
rdfs:
seeAlso
<
https://doi.org/10.1109/ISQED.2011.5770714
>
swrc:
series
<
https://dblp.l3s.de/d2r/resource/conferences/isqed
>
dc:
title
Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:InProceedings
rdf:
type
foaf:Document