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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/isqed/VemuriT23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Madhava_Sarma_Vemuri>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Umamaheswara_Rao_Tida>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FISQED57927.2023.10129285>
foaf:homepage <https://doi.org/10.1109/ISQED57927.2023.10129285>
dc:identifier DBLP conf/isqed/VemuriT23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FISQED57927.2023.10129285 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Madhava_Sarma_Vemuri>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Umamaheswara_Rao_Tida>
swrc:pages 1-8 (xsd:string)
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rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/isqed/isqed2023.html#VemuriT23>
rdfs:seeAlso <https://doi.org/10.1109/ISQED57927.2023.10129285>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/isqed>
dc:title Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document