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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/isqed/Zarkesh-HaLDLW03>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ken_Doniger>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Payman_Zarkesh-Ha>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Peter_Wright>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/S._Lakshminarayann>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/William_Loh>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FISQED.2003.1194767>
foaf:homepage <https://doi.org/10.1109/ISQED.2003.1194767>
dc:identifier DBLP conf/isqed/Zarkesh-HaLDLW03 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FISQED.2003.1194767 (xsd:string)
dcterms:issued 2003 (xsd:gYear)
rdfs:label Impact of Interconnect Pattern Density Information on a 90nm Technology ASIC Design Flow. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ken_Doniger>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Payman_Zarkesh-Ha>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Peter_Wright>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/S._Lakshminarayann>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/William_Loh>
swrc:pages 405-409 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/isqed/2003>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/isqed/Zarkesh-HaLDLW03/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/isqed/Zarkesh-HaLDLW03>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/isqed/isqed2003.html#Zarkesh-HaLDLW03>
rdfs:seeAlso <https://doi.org/10.1109/ISQED.2003.1194767>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/isqed>
dc:title Impact of Interconnect Pattern Density Information on a 90nm Technology ASIC Design Flow. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document