3D volumetric ultrasound imaging with a 32√ó32 CMUT array integrated with front-end ICs using flip-chip bonding technology.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/isscc/BhuyanCLWNOK13
Home
|
Example Publications
Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/conf/isscc/BhuyanCLWNOK13
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/%E2%88%9A%C4%96mer_Oralkan
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Amin_Nikoozadeh
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Anshuman_Bhuyan
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Butrus_T._Khuri-Yakub
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Byung-chul_Lee
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Ira_O._Wygant
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Jung_Woo_Choe
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FISSCC.2013.6487786
>
foaf:
homepage
<
https://doi.org/10.1109/ISSCC.2013.6487786
>
dc:
identifier
DBLP conf/isscc/BhuyanCLWNOK13
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FISSCC.2013.6487786
(xsd:string)
dcterms:
issued
2013
(xsd:gYear)
rdfs:
label
3D volumetric ultrasound imaging with a 32√ó32 CMUT array integrated with front-end ICs using flip-chip bonding technology.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/%E2%88%9A%C4%96mer_Oralkan
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Amin_Nikoozadeh
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Anshuman_Bhuyan
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Butrus_T._Khuri-Yakub
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Byung-chul_Lee
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Ira_O._Wygant
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Jung_Woo_Choe
>
swrc:
pages
396-397
(xsd:string)
dcterms:
partOf
<
https://dblp.l3s.de/d2r/resource/publications/conf/isscc/2013
>
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/conf/isscc/BhuyanCLWNOK13/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/conf/isscc/BhuyanCLWNOK13
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/conf/isscc/isscc2013.html#BhuyanCLWNOK13
>
rdfs:
seeAlso
<
https://doi.org/10.1109/ISSCC.2013.6487786
>
swrc:
series
<
https://dblp.l3s.de/d2r/resource/conferences/isscc
>
dc:
title
3D volumetric ultrasound imaging with a 32√ó32 CMUT array integrated with front-end ICs using flip-chip bonding technology.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:InProceedings
rdf:
type
foaf:Document