8Gb 3D DDR3 DRAM using through-silicon-via technology.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/isscc/KangCHALCAKKLJKKLKMJKCOLJYK09
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dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/conf/isscc/KangCHALCAKKLJKKLKMJKCOLJYK09
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Changhyun_Kim
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Dong-Hyun_Jang
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Dukmin_Kwon
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Eun-Mi_Lee
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Han-Sung_Joo
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Hoeju_Chung
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Hoon_Lee
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Hyun-Kyung_Kim
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Jaesung_Ahn
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Jaewook_Lee
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Jei-Hwan_Yoo
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Jin_Ho_Kim
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Jung-Bae_Lee
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Keum-Hee_Ma
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Man-Sik_Choi
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Nam-Seog_Kim
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Sae-Jang_Oh
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Seongmoo_Heo
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/So-Ra_Kim
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Sooho_Cha
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Soon-Hong_Ahn
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Tae-Kyung_Jung
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Uksong_Kang
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Woo-Seop_Kim
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FISSCC.2009.4977342
>
foaf:
homepage
<
https://doi.org/10.1109/ISSCC.2009.4977342
>
dc:
identifier
DBLP conf/isscc/KangCHALCAKKLJKKLKMJKCOLJYK09
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FISSCC.2009.4977342
(xsd:string)
dcterms:
issued
2009
(xsd:gYear)
rdfs:
label
8Gb 3D DDR3 DRAM using through-silicon-via technology.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Changhyun_Kim
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Dong-Hyun_Jang
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Dukmin_Kwon
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Eun-Mi_Lee
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Han-Sung_Joo
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Hoeju_Chung
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Hoon_Lee
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Hyun-Kyung_Kim
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Jaesung_Ahn
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Jaewook_Lee
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Jei-Hwan_Yoo
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Jin_Ho_Kim
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Jung-Bae_Lee
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Keum-Hee_Ma
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Man-Sik_Choi
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Nam-Seog_Kim
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Sae-Jang_Oh
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Seongmoo_Heo
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/So-Ra_Kim
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Sooho_Cha
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Soon-Hong_Ahn
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Tae-Kyung_Jung
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Uksong_Kang
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Woo-Seop_Kim
>
swrc:
pages
130-131
(xsd:string)
dcterms:
partOf
<
https://dblp.l3s.de/d2r/resource/publications/conf/isscc/2009
>
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/conf/isscc/KangCHALCAKKLJKKLKMJKCOLJYK09/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/conf/isscc/KangCHALCAKKLJKKLKMJKCOLJYK09
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/conf/isscc/isscc2009.html#KangCHALCAKKLJKKLKMJKCOLJYK09
>
rdfs:
seeAlso
<
https://doi.org/10.1109/ISSCC.2009.4977342
>
swrc:
series
<
https://dblp.l3s.de/d2r/resource/conferences/isscc
>
dc:
title
8Gb 3D DDR3 DRAM using through-silicon-via technology.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:InProceedings
rdf:
type
foaf:Document