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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/itc-asia/ReddyAK19>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Amit_Acharyya>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Raviteja_P._Reddy>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/S._Saqib_Khursheed>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FITC-Asia.2019.00034>
foaf:homepage <https://doi.org/10.1109/ITC-Asia.2019.00034>
dc:identifier DBLP conf/itc-asia/ReddyAK19 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FITC-Asia.2019.00034 (xsd:string)
dcterms:issued 2019 (xsd:gYear)
rdfs:label A Framework for TSV Based 3D-IC to Analyze Aging and TSV Thermo-Mechanical Stress on Soft Errors. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Amit_Acharyya>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Raviteja_P._Reddy>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/S._Saqib_Khursheed>
swrc:pages 121-126 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/itc-asia/2019>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/itc-asia/ReddyAK19/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/itc-asia/ReddyAK19>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/itc-asia/itc-asia2019.html#ReddyAK19>
rdfs:seeAlso <https://doi.org/10.1109/ITC-Asia.2019.00034>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/itc-asia>
dc:title A Framework for TSV Based 3D-IC to Analyze Aging and TSV Thermo-Mechanical Stress on Soft Errors. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document