Wire cost and communication analysis of self-assembled interconnect models for Networks-on-Chip.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/micro/TeuscherPMHA09
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Wire cost and communication analysis of self-assembled interconnect models for Networks-on-Chip.
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Wire cost and communication analysis of self-assembled interconnect models for Networks-on-Chip.
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