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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/nems/CaoLLWWLD23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chuanzhi_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Guandong_Liu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jie_Li>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lingling_Liu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rong_Cao>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Weihao_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yuanxing_Duan>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FNEMS57332.2023.10190863>
foaf:homepage <https://doi.org/10.1109/NEMS57332.2023.10190863>
dc:identifier DBLP conf/nems/CaoLLWWLD23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FNEMS57332.2023.10190863 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Research on the Cooling System for the System-on-Wafer Packaging. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chuanzhi_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Guandong_Liu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jie_Li>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lingling_Liu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rong_Cao>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Weihao_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yuanxing_Duan>
swrc:pages 33-36 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/nems/2023>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/nems/CaoLLWWLD23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/nems/CaoLLWWLD23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/nems/nems2023.html#CaoLLWWLD23>
rdfs:seeAlso <https://doi.org/10.1109/NEMS57332.2023.10190863>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/nems>
dc:title Research on the Cooling System for the System-on-Wafer Packaging. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document