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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/nems/ChuangLHLY14>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ai-Ho_Liao>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chih-Chung_Huang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chih-Kuang_Yeh>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ho-Chiao_Chuang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Wei-Hong_Lai>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FNEMS.2014.6908770>
foaf:homepage <https://doi.org/10.1109/NEMS.2014.6908770>
dc:identifier DBLP conf/nems/ChuangLHLY14 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FNEMS.2014.6908770 (xsd:string)
dcterms:issued 2014 (xsd:gYear)
rdfs:label Fabrication of through-silicon vias (TSV) by nickel electroplating in supercritical CO2. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ai-Ho_Liao>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chih-Chung_Huang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chih-Kuang_Yeh>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ho-Chiao_Chuang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Wei-Hong_Lai>
swrc:pages 108-112 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/nems/2014>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/nems/ChuangLHLY14/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/nems/ChuangLHLY14>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/nems/nems2014.html#ChuangLHLY14>
rdfs:seeAlso <https://doi.org/10.1109/NEMS.2014.6908770>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/nems>
dc:title Fabrication of through-silicon vias (TSV) by nickel electroplating in supercritical CO2. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document