[RDF data]
Home | Example Publications
PropertyValue
dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/nems/DuYKLYJXL23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Binbin_Jiao>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lv_Xiaorui>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Pengrong_Lin>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ruiwen_Liu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Shichang_Yun>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xiangbin_Du>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yanmei_Kong>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yuxin_Ye>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FNEMS57332.2023.10190924>
foaf:homepage <https://doi.org/10.1109/NEMS57332.2023.10190924>
dc:identifier DBLP conf/nems/DuYKLYJXL23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FNEMS57332.2023.10190924 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Embedded manifold cooling for efficient thermal management of flexible electronics. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Binbin_Jiao>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lv_Xiaorui>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Pengrong_Lin>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ruiwen_Liu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Shichang_Yun>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xiangbin_Du>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yanmei_Kong>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yuxin_Ye>
swrc:pages 209-212 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/nems/2023>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/nems/DuYKLYJXL23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/nems/DuYKLYJXL23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/nems/nems2023.html#DuYKLYJXL23>
rdfs:seeAlso <https://doi.org/10.1109/NEMS57332.2023.10190924>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/nems>
dc:title Embedded manifold cooling for efficient thermal management of flexible electronics. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document