[RDF data]
Home | Example Publications
PropertyValue
dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/newcas/NguyenANPCBC22>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Gabriel_Nobert>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Glenn_E._R._Cowan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Nicolas_G._Constantin>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Nueraimaiti_Aimaier>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tan_Pham>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Van_Ha_Nguyen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yves_Blaqui%E2%88%9A%C2%AEre>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FNEWCAS52662.2022.9842234>
foaf:homepage <https://doi.org/10.1109/NEWCAS52662.2022.9842234>
dc:identifier DBLP conf/newcas/NguyenANPCBC22 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FNEWCAS52662.2022.9842234 (xsd:string)
dcterms:issued 2022 (xsd:gYear)
rdfs:label A Reconfigurable Power System-in-Package Module using GaN HEMTs and IC Bare Dies on LTCC Substrate: Design - Implementation - Experiment and Future Directions. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Gabriel_Nobert>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Glenn_E._R._Cowan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Nicolas_G._Constantin>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Nueraimaiti_Aimaier>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tan_Pham>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Van_Ha_Nguyen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yves_Blaqui%E2%88%9A%C2%AEre>
swrc:pages 188-192 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/newcas/2022>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/newcas/NguyenANPCBC22/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/newcas/NguyenANPCBC22>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/newcas/newcas2022.html#NguyenANPCBC22>
rdfs:seeAlso <https://doi.org/10.1109/NEWCAS52662.2022.9842234>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/newcas>
dc:title A Reconfigurable Power System-in-Package Module using GaN HEMTs and IC Bare Dies on LTCC Substrate: Design - Implementation - Experiment and Future Directions. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document