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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/nvmsa/WangS19>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bin_Sun>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xinsheng_Wang>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FNVMSA.2019.8863516>
foaf:homepage <https://doi.org/10.1109/NVMSA.2019.8863516>
dc:identifier DBLP conf/nvmsa/WangS19 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FNVMSA.2019.8863516 (xsd:string)
dcterms:issued 2019 (xsd:gYear)
rdfs:label Effective Compression Modeling for Packaged Integrated Circuit with Compressive Sensing. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bin_Sun>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xinsheng_Wang>
swrc:pages 1-2 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/nvmsa/2019>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/nvmsa/WangS19/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/nvmsa/WangS19>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/nvmsa/nvmsa2019.html#WangS19>
rdfs:seeAlso <https://doi.org/10.1109/NVMSA.2019.8863516>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/nvmsa>
dc:title Effective Compression Modeling for Packaged Integrated Circuit with Compressive Sensing. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document