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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/ofc/ChangBRHWHTKG16>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Arun_Tiruvur>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Frank_Y._Chang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ishwar_Hosagrahar>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jamal_Riani>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jennifer_Wu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Karthik_Gopalakrishnan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Pulkit_Khandelwal>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sameer_Herlekar>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sudeep_Bhoja>
foaf:homepage <https://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=7537317>
dc:identifier DBLP conf/ofc/ChangBRHWHTKG16 (xsd:string)
dcterms:issued 2016 (xsd:gYear)
rdfs:label Link performance investigation of industry first 100G PAM4 IC chipset with real-time DSP for data center connectivity. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Arun_Tiruvur>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Frank_Y._Chang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ishwar_Hosagrahar>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jamal_Riani>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jennifer_Wu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Karthik_Gopalakrishnan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Pulkit_Khandelwal>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sameer_Herlekar>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sudeep_Bhoja>
swrc:pages 1-3 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/ofc/2016>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/ofc/ChangBRHWHTKG16/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/ofc/ChangBRHWHTKG16>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/ofc/ofc2016.html#ChangBRHWHTKG16>
rdfs:seeAlso <https://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=7537317>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/ofc>
dc:title Link performance investigation of industry first 100G PAM4 IC chipset with real-time DSP for data center connectivity. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document