High-throughput multiple dies-to-wafer (D2W) bonding for III/V-on-Si hybrid lasers.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/ofc/LuoCSHLYWL15
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dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/conf/ofc/LuoCSHLYWL15
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Guo-Qiang_Lo
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Junfeng_Song
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Mingbin_Yu
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Qijie_Wang
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Tsung-Yang_Liow
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Xianshu_Luo
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Xiaonan_Hu
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Yulian_Cao
>
foaf:
homepage
<
https://ieeexplore.ieee.org/document/7121894
>
dc:
identifier
DBLP conf/ofc/LuoCSHLYWL15
(xsd:string)
dcterms:
issued
2015
(xsd:gYear)
rdfs:
label
High-throughput multiple dies-to-wafer (D2W) bonding for III/V-on-Si hybrid lasers.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Guo-Qiang_Lo
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Junfeng_Song
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Mingbin_Yu
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Qijie_Wang
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Tsung-Yang_Liow
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Xianshu_Luo
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Xiaonan_Hu
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Yulian_Cao
>
swrc:
pages
1-3
(xsd:string)
dcterms:
partOf
<
https://dblp.l3s.de/d2r/resource/publications/conf/ofc/2015
>
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/conf/ofc/LuoCSHLYWL15/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/conf/ofc/LuoCSHLYWL15
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/conf/ofc/ofc2015.html#LuoCSHLYWL15
>
rdfs:
seeAlso
<
https://ieeexplore.ieee.org/document/7121894
>
swrc:
series
<
https://dblp.l3s.de/d2r/resource/conferences/ofc
>
dc:
title
High-throughput multiple dies-to-wafer (D2W) bonding for III/V-on-Si hybrid lasers.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:InProceedings
rdf:
type
foaf:Document