Study of High Coupling Efficiency Cone Micro-Lensed Fiber Applied in Silicon Photonics Chip Packaging.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/ps/TuLSC22
Home
|
Example Publications
Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/conf/ps/TuLSC22
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Chun-Nien_Liu
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Jim-Han_Tu
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Tien-Tsorng_Shih
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Wood-Hi_Cheng
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.23919%2FOECC%2FPSC53152.2022.9850128
>
foaf:
homepage
<
https://doi.org/10.23919/OECC/PSC53152.2022.9850128
>
dc:
identifier
DBLP conf/ps/TuLSC22
(xsd:string)
dc:
identifier
DOI doi.org%2F10.23919%2FOECC%2FPSC53152.2022.9850128
(xsd:string)
dcterms:
issued
2022
(xsd:gYear)
rdfs:
label
Study of High Coupling Efficiency Cone Micro-Lensed Fiber Applied in Silicon Photonics Chip Packaging.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Chun-Nien_Liu
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Jim-Han_Tu
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Tien-Tsorng_Shih
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Wood-Hi_Cheng
>
swrc:
pages
1-4
(xsd:string)
dcterms:
partOf
<
https://dblp.l3s.de/d2r/resource/publications/conf/ps/2022
>
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/conf/ps/TuLSC22/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/conf/ps/TuLSC22
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/conf/ps/psc2022.html#TuLSC22
>
rdfs:
seeAlso
<
https://doi.org/10.23919/OECC/PSC53152.2022.9850128
>
swrc:
series
<
https://dblp.l3s.de/d2r/resource/conferences/ps
>
dc:
title
Study of High Coupling Efficiency Cone Micro-Lensed Fiber Applied in Silicon Photonics Chip Packaging.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:InProceedings
rdf:
type
foaf:Document