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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/reconfig/FusiaraSPHKSH18>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Gijs_Schoonderbeek>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Grant_Hampson>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Johan_Pragt>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Leon_Hiemstra>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Menno_Schuil>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Paulina_Fusiara>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sjouke_Kuindersma>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FRECONFIG.2018.8641727>
foaf:homepage <https://doi.org/10.1109/RECONFIG.2018.8641727>
dc:identifier DBLP conf/reconfig/FusiaraSPHKSH18 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FRECONFIG.2018.8641727 (xsd:string)
dcterms:issued 2018 (xsd:gYear)
rdfs:label Design and Fabrication of Full Board Direct Liquid Cooling Heat Sink for Densely Packed FPGA Processing Boards. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Gijs_Schoonderbeek>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Grant_Hampson>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Johan_Pragt>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Leon_Hiemstra>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Menno_Schuil>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Paulina_Fusiara>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sjouke_Kuindersma>
swrc:pages 1-8 (xsd:string)
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rdfs:seeAlso <https://doi.org/10.1109/RECONFIG.2018.8641727>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/reconfig>
dc:title Design and Fabrication of Full Board Direct Liquid Cooling Heat Sink for Densely Packed FPGA Processing Boards. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document