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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/robio/JiangFHC18>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Haibo_Huang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Liguo_Chen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Shanshan_Feng>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yongtao_Jiang>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FROBIO.2018.8665140>
foaf:homepage <https://doi.org/10.1109/ROBIO.2018.8665140>
dc:identifier DBLP conf/robio/JiangFHC18 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FROBIO.2018.8665140 (xsd:string)
dcterms:issued 2018 (xsd:gYear)
rdfs:label Research on High Precision Micro-assembly Technology for Automated MEMS Thermopile Chip Die Bonding Process. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Haibo_Huang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Liguo_Chen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Shanshan_Feng>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yongtao_Jiang>
swrc:pages 2409-2414 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/robio/2018>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/robio/JiangFHC18/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/robio/JiangFHC18>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/robio/robio2018.html#JiangFHC18>
rdfs:seeAlso <https://doi.org/10.1109/ROBIO.2018.8665140>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/robio>
dc:title Research on High Precision Micro-assembly Technology for Automated MEMS Thermopile Chip Die Bonding Process. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document