Analysis of the Proposed Boundary Conditions for the Conductive Material and Substrate Thickness of Air-Substrate Microstrip Patch Antenna via Graphical Verification Method. | D2R Server publishing the DBLP Bibliography Database, hosted at L3S Research Center

Property	Value
dcterms:bibliographicCitation	<http://dblp.uni-trier.de/rec/bibtex/conf/rovisp/MohammedKASHNA21>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Abdullahi_S._B._Mohammed>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Fathul_Najmi>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Mohd_Fadzil_bin_Ain>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Roslina_Hussin>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Shahanawaz_Kamal>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Shahrel_Azmin_Suandi>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Zainal_Arifin_Ahmad>
foaf:homepage	<http://dx.doi.org/doi.org%2F10.1007%2F978-981-16-8129-5%5F14>
foaf:homepage	<https://doi.org/10.1007/978-981-16-8129-5_14>
dc:identifier	DBLP conf/rovisp/MohammedKASHNA21 (xsd:string)
dc:identifier	DOI doi.org%2F10.1007%2F978-981-16-8129-5%5F14 (xsd:string)
dcterms:issued	2021 (xsd:gYear)
rdfs:label	Analysis of the Proposed Boundary Conditions for the Conductive Material and Substrate Thickness of Air-Substrate Microstrip Patch Antenna via Graphical Verification Method. (xsd:string)
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Abdullahi_S._B._Mohammed>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Fathul_Najmi>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Mohd_Fadzil_bin_Ain>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Roslina_Hussin>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Shahanawaz_Kamal>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Shahrel_Azmin_Suandi>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Zainal_Arifin_Ahmad>
swrc:pages	86-92 (xsd:string)
dcterms:partOf	<https://dblp.l3s.de/d2r/resource/publications/conf/rovisp/2021>
owl:sameAs	<http://bibsonomy.org/uri/bibtexkey/conf/rovisp/MohammedKASHNA21/dblp>
owl:sameAs	<http://dblp.rkbexplorer.com/id/conf/rovisp/MohammedKASHNA21>
rdfs:seeAlso	<http://dblp.uni-trier.de/db/conf/rovisp/rovisp2021.html#MohammedKASHNA21>
rdfs:seeAlso	<https://doi.org/10.1007/978-981-16-8129-5_14>
swrc:series	<https://dblp.l3s.de/d2r/resource/conferences/rovisp>
dc:title	Analysis of the Proposed Boundary Conditions for the Conductive Material and Substrate Thickness of Air-Substrate Microstrip Patch Antenna via Graphical Verification Method. (xsd:string)
dc:type	<http://purl.org/dc/dcmitype/Text>
rdf:type	swrc:InProceedings
rdf:type	foaf:Document