Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/scsc/BasaranGLL07
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2007
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Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging.
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concurrent loading, dynamic analysis, electronics packaging reliability, solder joint life prediction
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Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging.
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