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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/slip/KimML09>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Dae_Hyun_Kim_0004>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Saibal_Mukhopadhyay>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sung_Kyu_Lim>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1145%2F1572471.1572486>
foaf:homepage <https://doi.org/10.1145/1572471.1572486>
dc:identifier DBLP conf/slip/KimML09 (xsd:string)
dc:identifier DOI doi.org%2F10.1145%2F1572471.1572486 (xsd:string)
dcterms:issued 2009 (xsd:gYear)
rdfs:label Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Dae_Hyun_Kim_0004>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Saibal_Mukhopadhyay>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sung_Kyu_Lim>
swrc:pages 85-92 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/slip/2009>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/slip/KimML09/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/slip/KimML09>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/slip/slip2009.html#KimML09>
rdfs:seeAlso <https://doi.org/10.1145/1572471.1572486>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/slip>
dc:subject 3d ic, interconnect prediction, rent's rule, through silicon via, tsv, wirelength distribution (xsd:string)
dc:title Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document