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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/slip/PapanikolaouMCCMRSM03>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Antonis_Papanikolaou>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/David_De_Roest>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Francky_Catthoor>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Henk_Corporaal>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hugo_De_Man>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Karen_Maex>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Michele_Stucchi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Miguel_Miranda>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1145%2F639929.639954>
foaf:homepage <https://doi.org/10.1145/639929.639954>
dc:identifier DBLP conf/slip/PapanikolaouMCCMRSM03 (xsd:string)
dc:identifier DOI doi.org%2F10.1145%2F639929.639954 (xsd:string)
dcterms:issued 2003 (xsd:gYear)
rdfs:label Global interconnect trade-off for technology over memory modules to application level: case study. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Antonis_Papanikolaou>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/David_De_Roest>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Francky_Catthoor>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Henk_Corporaal>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hugo_De_Man>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Karen_Maex>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Michele_Stucchi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Miguel_Miranda>
swrc:pages 125-132 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/slip/2003>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/slip/PapanikolaouMCCMRSM03/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/slip/PapanikolaouMCCMRSM03>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/slip/slip2003.html#PapanikolaouMCCMRSM03>
rdfs:seeAlso <https://doi.org/10.1145/639929.639954>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/slip>
dc:subject Pareto-optimal energy/delay interconnect exploration, interconnect wire processing, intra/inter-memory interconnect (xsd:string)
dc:title Global interconnect trade-off for technology over memory modules to application level: case study. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document