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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/smc/ChangCLJ09>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chuan-Yu_Chang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/ChunHsi_Li>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/MuDer_Jeng>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yung-Chi_Chang>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FICSMC.2009.5346751>
foaf:homepage <https://doi.org/10.1109/ICSMC.2009.5346751>
dc:identifier DBLP conf/smc/ChangCLJ09 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FICSMC.2009.5346751 (xsd:string)
dcterms:issued 2009 (xsd:gYear)
rdfs:label Automatic Die Inspection for Post-sawing LED Wafers. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chuan-Yu_Chang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/ChunHsi_Li>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/MuDer_Jeng>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yung-Chi_Chang>
swrc:pages 1615-1620 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/smc/2009>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/smc/ChangCLJ09/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/smc/ChangCLJ09>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/smc/smc2009.html#ChangCLJ09>
rdfs:seeAlso <https://doi.org/10.1109/ICSMC.2009.5346751>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/smc>
dc:title Automatic Die Inspection for Post-sawing LED Wafers. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document