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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/vlsi-dat/ChiCKHWHDL12>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Cheng-Wen_Wu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chun-Chuan_Chi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ding-Ming_Kwai>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Li-Ming_Denq>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tsung-Hsiang_Lin>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yu-Tsao_Hsing>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yu-Ying_Hsiao>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yung-Fa_Chou>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FVLSI-DAT.2012.6212621>
foaf:homepage <https://doi.org/10.1109/VLSI-DAT.2012.6212621>
dc:identifier DBLP conf/vlsi-dat/ChiCKHWHDL12 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FVLSI-DAT.2012.6212621 (xsd:string)
dcterms:issued 2012 (xsd:gYear)
rdfs:label 3D-IC BISR for stacked memories using cross-die spares. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Cheng-Wen_Wu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chun-Chuan_Chi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ding-Ming_Kwai>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Li-Ming_Denq>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tsung-Hsiang_Lin>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yu-Tsao_Hsing>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yu-Ying_Hsiao>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yung-Fa_Chou>
swrc:pages 1-4 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/vlsi-dat/2012>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/vlsi-dat/ChiCKHWHDL12/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/vlsi-dat/ChiCKHWHDL12>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/vlsi-dat/vlsi-dat2012.html#ChiCKHWHDL12>
rdfs:seeAlso <https://doi.org/10.1109/VLSI-DAT.2012.6212621>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/vlsi-dat>
dc:title 3D-IC BISR for stacked memories using cross-die spares. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document