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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/vlsi-dat/ChouTYSCC13>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chung-Han_Chou>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hao_Yu_0001>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jui-Hung_Chien>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Nien-Yu_Tsai>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Shih-Chieh_Chang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yiyu_Shi_0001>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FVLDI-DAT.2013.6533886>
foaf:homepage <https://doi.org/10.1109/VLDI-DAT.2013.6533886>
dc:identifier DBLP conf/vlsi-dat/ChouTYSCC13 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FVLDI-DAT.2013.6533886 (xsd:string)
dcterms:issued 2013 (xsd:gYear)
rdfs:label On the futility of thermal through-silicon-vias. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chung-Han_Chou>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hao_Yu_0001>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jui-Hung_Chien>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Nien-Yu_Tsai>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Shih-Chieh_Chang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yiyu_Shi_0001>
swrc:pages 1-6 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/vlsi-dat/2013>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/vlsi-dat/ChouTYSCC13/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/vlsi-dat/ChouTYSCC13>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/vlsi-dat/vlsi-dat2013.html#ChouTYSCC13>
rdfs:seeAlso <https://doi.org/10.1109/VLDI-DAT.2013.6533886>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/vlsi-dat>
dc:title On the futility of thermal through-silicon-vias. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document