Challenges for high-density 16Gb ReRAM with 27nm technology.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/vlsic/SillsYCCSAR15
Home
|
Example Publications
Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/conf/vlsic/SillsYCCSAR15
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Alessandro_Calderoni
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Christopher_Cardon
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Jonathan_Strand
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Katsuhisa_Aratani
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Nirmal_Ramaswamy
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Scott_Sills
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Shuichiro_Yasuda
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2FVLSIC.2015.7231366
>
foaf:
homepage
<
https://doi.org/10.1109/VLSIC.2015.7231366
>
dc:
identifier
DBLP conf/vlsic/SillsYCCSAR15
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2FVLSIC.2015.7231366
(xsd:string)
dcterms:
issued
2015
(xsd:gYear)
rdfs:
label
Challenges for high-density 16Gb ReRAM with 27nm technology.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Alessandro_Calderoni
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Christopher_Cardon
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Jonathan_Strand
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Katsuhisa_Aratani
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Nirmal_Ramaswamy
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Scott_Sills
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Shuichiro_Yasuda
>
swrc:
pages
106-
(xsd:string)
dcterms:
partOf
<
https://dblp.l3s.de/d2r/resource/publications/conf/vlsic/2015
>
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/conf/vlsic/SillsYCCSAR15/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/conf/vlsic/SillsYCCSAR15
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/conf/vlsic/vlsic2015.html#SillsYCCSAR15
>
rdfs:
seeAlso
<
https://doi.org/10.1109/VLSIC.2015.7231366
>
swrc:
series
<
https://dblp.l3s.de/d2r/resource/conferences/vlsic
>
dc:
title
Challenges for high-density 16Gb ReRAM with 27nm technology.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:InProceedings
rdf:
type
foaf:Document