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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/vlsid/KulkarniPM95>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/K._D._Patil>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/K._V._V._Murthy>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/S._Y._Kulkarni>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FICVD.1995.512120>
foaf:homepage <https://doi.org/10.1109/ICVD.1995.512120>
dc:identifier DBLP conf/vlsid/KulkarniPM95 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FICVD.1995.512120 (xsd:string)
dcterms:issued 1995 (xsd:gYear)
rdfs:label Transmission line model parameters for very high speed VLSI interconnects in MCMs using FEM with special elements. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/K._D._Patil>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/K._V._V._Murthy>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/S._Y._Kulkarni>
swrc:pages 260-263 (xsd:string)
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rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/vlsid/vlsid1995.html#KulkarniPM95>
rdfs:seeAlso <https://doi.org/10.1109/ICVD.1995.512120>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/vlsid>
dc:subject very high speed integrated circuits; multichip modules; transmission line theory; finite element analysis; integrated circuit interconnections; integrated circuit packaging; transmission line model parameters; very high speed VLSI interconnects; VLSI interconnects; MCM; FEM; finite element method; higher order isoparametric elements; multichip modules; 2D interconnect/dielectric packaging structures; quadrilateral infinite elements; signal conductor boundaries; sharp corners; computation time (xsd:string)
dc:title Transmission line model parameters for very high speed VLSI interconnects in MCMs using FEM with special elements. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document