very high speed integrated circuits; multichip modules; transmission line theory; finite element analysis; integrated circuit interconnections; integrated circuit packaging; transmission line model parameters; very high speed VLSI interconnects; VLSI interconnects; MCM; FEM; finite element method; higher order isoparametric elements; multichip modules; 2D interconnect/dielectric packaging structures; quadrilateral infinite elements; signal conductor boundaries; sharp corners; computation time
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