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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/vlsid/NaseemMBHBS95>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ajay_P._Malshe>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hameed_A._Naseem>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Len_W._Schaper>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/M._Shahid_Haque>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rajan_A._Beera>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/William_D._Brown>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FICVD.1995.512107>
foaf:homepage <https://doi.org/10.1109/ICVD.1995.512107>
dc:identifier DBLP conf/vlsid/NaseemMBHBS95 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FICVD.1995.512107 (xsd:string)
dcterms:issued 1995 (xsd:gYear)
rdfs:label CVD-diamond substrates for multi-chip modules (MCMs). (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ajay_P._Malshe>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hameed_A._Naseem>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Len_W._Schaper>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/M._Shahid_Haque>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rajan_A._Beera>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/William_D._Brown>
swrc:pages 194- (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/vlsid/1995>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/vlsid/NaseemMBHBS95/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/vlsid/NaseemMBHBS95>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/vlsid/vlsid1995.html#NaseemMBHBS95>
rdfs:seeAlso <https://doi.org/10.1109/ICVD.1995.512107>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/vlsid>
dc:subject multichip modules; diamond; substrates; polishing; laser beam machining; metallisation; CVD coatings; elemental semiconductors; chemical vapour deposition; CVD-diamond substrates; multichip modules; 3D MCM; chemical vapor deposition; diamond thin films; polishing; planarization; laser drilling; via holes; metallization; dielectric coatings; multilayer interconnects; fabrication; C (xsd:string)
dc:title CVD-diamond substrates for multi-chip modules (MCMs). (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document