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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/vlsit/GongXWJYNHWYGLL23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bowen_Nie>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jianfeng_Gao_0005>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jianguo_Yang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jun_Luo>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Junfeng_Li>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lihua_Xu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ling_Li>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lingfei_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ming_Liu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Peng_Yuan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Pengfei_Jiang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Qing_Luo>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Steve_S._Chung>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tiancheng_Gong>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Wei_Wei>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yang_Yang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yuan_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yuanquan_Huang>
foaf:homepage <http://dx.doi.org/doi.org%2F10.23919%2FVLSITechnologyandCir57934.2023.10185402>
foaf:homepage <https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185402>
dc:identifier DBLP conf/vlsit/GongXWJYNHWYGLL23 (xsd:string)
dc:identifier DOI doi.org%2F10.23919%2FVLSITechnologyandCir57934.2023.10185402 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label First Demonstration of a Design Methodology for Highly Reliable Operation at High Temperature on 128kb 1T1C FeRAM Chip. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bowen_Nie>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jianfeng_Gao_0005>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jianguo_Yang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jun_Luo>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Junfeng_Li>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lihua_Xu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ling_Li>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lingfei_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ming_Liu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Peng_Yuan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Pengfei_Jiang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Qing_Luo>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Steve_S._Chung>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tiancheng_Gong>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Wei_Wei>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yang_Yang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yuan_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yuanquan_Huang>
swrc:pages 1-2 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/vlsit/2023>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/vlsit/GongXWJYNHWYGLL23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/vlsit/GongXWJYNHWYGLL23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/vlsit/vlsit2023.html#GongXWJYNHWYGLL23>
rdfs:seeAlso <https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185402>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/vlsit>
dc:title First Demonstration of a Design Methodology for Highly Reliable Operation at High Temperature on 128kb 1T1C FeRAM Chip. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document